
Website JPL
Job Description:
The Jet Propulsion Laboratory (JPL) is NASA’s lead center for robotic exploration of the solar system. Our core competency is the end-to-end implementation of unprecedented robotic space missions to study Earth, the Solar System, and the Universe.
Job Responsibilities:
- Lead qualification of new materials and processes in electronic manufacturing and packaging applications
- Review product quality and identifying process changes for continuous improvement
- Review printed circuit board designs and create necessary programs and fixtures for surface mount assembly
- Provide engineering support and expertise to electronic fabrication activities both in-house and at vendors and external partners
- Qualify and maintain SMT equipment
- Support the manufacture and assembly of space flight quality Printed Ciruit Boards (PCB) and Circuit Card Assemblies (CCA) as the engineering Lead of the Surface Mount Technology (SMT) Laboratory
- Modify and author technical process requirements and guidelines as appropriate, generate manufacturing instructions and develop equipment Standard Operation Procedures.
Job Requirements:
- Excellent verbal and written communication skills
- Experience with task planning, cost estimating and cost control, managing schedules and deliverables, meeting commitments
- Extensive experience with the manufacture and assembly of PCB’s and CCA’s
- Excellent teamwork skills, and ability to work across disciplines and organizations
- Requires a Bachelor’s degree in Mechanical, Electrical Engineering, Material Science, or a relevant field with a minimum of 9 years of experience
- or a Master’s degree with a minimum of 7 years of experience or a PhD with a minimum of 5 years of related experience
- Extensive knowledge of SMT materials, processes, and equipment
Qualification & Experience:
- 10+ years SMT experience
- Experience and knowledge in the production, manufacture and assembly of aerospace flight components and electronic assemblies
- Extensive knowledge of assembly materials, including solder metallurgy, flux, paste, solder spheres, underfills, polymerics
- Extensive knowledge of SMT processes such as solder paste deposition, surface mount pick and place, vapor phase solder reflow and aqueous cleaning
Job Details:
Company: JPL
Vacancy Type: Full Time
Job Location: Pasadena, CA, US
Application Deadline: N/A
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